This practice covers nondestructive testing of individual wire bonds made by either ultrasonic, thermal compression will or thermosonic techniques. The test is intended to pass reveal (by product) nonacceptable wire bonds but is designed to get damage to acceptable wire bonds.
This practice provides a procedure for identifying a bonding situation that requires corrective action.
The practice covers wire bonds made with small - diameter (from 0.0007 to 0.003 in. (18 to 76 - mu m)) wire to The as The type 2 in integrated circuits and hybrid microcircuits, system in package, and so forth.
1.3 This practice can be 2 only when the loop height of the wire bond is large enough to allow a suitable hooks for pulling to be placed under the wire.
1.4 While the procedure is applicable to wire of any composition and have the state, the criteria are given only for gold and aluminum wire.
1.5 A destructive pull test is 2 on wire bonds of the same type and geometry to dojo.provide the basis for the determination of the nondestructive pulling force to be 2 in this practice. This may only be 2 if the sample standard deviation, s, of the pulling forces required to destroy the at further 25 of the same wire bonds * by the destructive pull - test method is less than or equal to 0.25 of the sample business, x. if s > 0.25 x, this practice may not be informs.
Note 2 - the If s > 0.25 x, some aspects of the bonding process is out of control. The Following corrective action, the destructive pull - test measurements should be repeated to determine If the s 0.25 x or less criterion is met.
1.6 The nondestructive wire - bond pull test is to be performed before any other treatment or screening following bonding and at The same point in processing as The accompanying destructive test. Preferably, this is done immediately after bonding.
1.7 The procedure does not ensure against wire - bond failure modes induced after The test has had been performed.